Chips 2020 : A Guide to the Future of Nanoelectronics. 1st ed. 2012

種類:

電子ブック

責任表示:

edited by Bernd Hoefflinger

出版情報:

Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2012

著者名:

• Hoefflinger, Bernd.
• SpringerLink (Online service)

シリーズ名:

The Frontiers Collection ;

ISBN:

9783642230967 [3642230962]    

注記:

Introduction: Towards Sustainable 2020 Nanoelectronics -- From Microelectronics to Nanoelectronics -- The Future of Eight Chip Technologies -- Analog–Digital Interfaces -- Interconnects and Transceivers -- Requirements and Markets for Nanoelectronics -- ITRS: The International Technology Roadmap for Semiconductors -- Nanolithography -- Power-Efficient Design Challenges -- Superprocessors and Supercomputers -- Towards Terabit Memories -- 3D Integration for Wireless Multimedia -- The Next-Generation Mobile User-Experience -- MEMS (Micro-Electro-Mechanical Systems) for Automotive and Consumer -- Vision Sensors and Cameras -- Digital Neural Networks for New Media -- Retinal Implants for Blind Patients -- Silicon Brains -- Energy Harvesting and Chip Autonomy -- The Energy Crisis -- The Extreme-Technology Industry -- Education and Research for the Age of Nanoelectronics -- 2020 World with Chips.
The chips in present-day cell phones already contain billions of sub-100-nanometer transistors. By 2020, however, we will see systems-on-chips with trillions of 10-nanometer transistors. But this will be the end of the miniaturization, because yet smaller transistors, containing just a few control atoms, are subject to statistical fluctuations and thus no longer useful. We also need to worry about a potential energy crisis, because in less than five years from now, with current chip technology, the internet alone would consume the total global electrical power! This book presents a new, sustainable roadmap towards ultra-low-energy (femto-Joule), high-performance electronics. The focus is on the energy-efficiency of the various chip functions: sensing, processing, and communication, in a top-down spirit involving new architectures such as silicon brains, ultra-low-voltage circuits, energy harvesting, and 3D silicon technologies. Recognized world leaders from industry and from the research community share their

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